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LABTTT Metallographic Experiment - Chip Analysis Case Sharing
2026-05-29
Customer requirement: There are many small holes on the back of the chip, and there is epoxy adhesive inside the holes. It needs to be ground to expose the cross-section of any row of small holes in the top, middle, and bottom positions of the chip. The adhesive entering the holes can be observed, photographed, and the height of the adhesive entering the holes can be measured and recorded.
1、 Mounting
Hold the sample vertically with a sample clamp, with the testing surface facing downwards, ensuring that it is tightly attached to the bottom of the mold vertically.
2、 Cutting
After clamping the sample with an inlay fixture, align it with the position and cut it.
3、 Grinding and polishing
Clamp the cut samples onto the sample tray according to the operating procedures, and symmetrically clamp the auxiliary parts (or polish more than 3 samples at a time).
4、 Microscopic observation
The precise measurement of the adhesive height of the small hole on the back of the chip depends on the position control of grinding to the target cross-section. LABTT can customize a complete set of metallographic sampling solutions based on your specific sample and testing requirements - from cutting, grinding to polishing, making observation clearer and measurement more accurate. If you have any needs, please feel free to contact us.
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