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Is the chip adhesive still manually tested edge by edge? LABTT fully automatic measurement system, one PCB with high adhesive on all four sides can be obtained with just one click
2026-09-22
The climbing height of the adhesive after die bonding directly determines the reliability and appearance quality of the packaging: insufficient adhesive amount, inadequate bonding and sealing; Excessive glue quantity leads to overflow and contamination of adjacent areas. And climbing glue requires measuring along the four side walls of the chip one by one. In the past, it could only rely on manual focusing and reading under a microscope, which was inefficient and the results varied from person to person.
We have launched the MM-45XM-XYZ-3D-C fully automatic climbing height measurement system - a specialized climbing detection equipment for the semiconductor and LED packaging industries. The sample is clamped once, and the four sides of the chip are fully automatically measured; Any chip, four edges, and multiple measurement lines on each side on a PCB can be obtained with just one click for adhesive height data.
01 One machine dedicated, 45 ° side view optical path designed specifically for climbing rubber observation
The system adopts a 45 ° tilted observation optical path to observe the climbing contour of the adhesive layer from the side of the chip, avoiding the obstruction of the adhesive layer by the chip body when viewed from above; Combined with high-resolution industrial cameras and "circular light source+45 ° side emitting cold light" illumination, the edge contour of the adhesive layer is clear, suitable for conductive silver paste, non-conductive adhesive Underfill、 Various types of adhesives such as thermal conductive adhesive.
02 Fully automatic four-dimensional motion, measuring all four sides in one clamping operation
XY displacement table automatic positioning, automatic focusing, continuous zoom, and automatic 3D rotation four axis linkage: After the sample is fixed, there is no need to move it. The system automatically measures the four sides of the chip at 0 °, 90 °, 180 °, and 270 ° in sequence, and the entire process is automatically imaged, measured, judged, and reported, eliminating manual positioning and reading errors and adapting to mass production line quality inspection.
03 Three core indicators, output at once
In addition to the Fillet Height, two indicators of adhesive overflow width and the percentage of adhesive climbing to chip thickness are synchronously output to comprehensively evaluate the quality of the dispensing process; The measurement boundary supports manual correction and adapts to different colors and transparency of adhesive types.
04 Digital quality inspection closed-loop, data traceability
Automatic storage of detection data and images: built-in qualified threshold for automatic judgment of OK/NG and batch classification statistics; Support Excel export; Optional MES/LIMS system docking and scanning to enter batch numbers, achieving workshop data interoperability and full process quality traceability.
From manual visual inspection on each side to one click automatic counting - MM-45XM-XYZ-3D-C eliminates manual labor and errors in rubber climbing detection, returning to the rhythm of production line quality inspection.
For more product information or to schedule a demonstration, please feel free to leave a message or contact us.
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