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LABTT Debuts at Shenzhen International Integrated Circuit Innovation Expo, Two New Microscopic Testing Products Attract Attention
2026-09-22
Recently, the IICIE International Integrated Circuit Innovation Expo was grandly held at the Shenzhen International Convention and Exhibition Center. This exhibition will be held concurrently with the 27th China International Optoelectronics Expo and Elexcon Shenzhen International Electronics Show. The total exhibition area of the three exhibitions will exceed 320000 square meters, attracting over 5000 participating companies and an expected attendance of over 240000 professional visitors.
At this grand event of the entire integrated circuit industry chain, LABTT unveiled two latest micro inspection equipment, namely the fully automatic climbing glue height measurement system and the electric variable magnification measurement microscope, focusing on the precision inspection needs of the semiconductor packaging process.
During the exhibition, the LABTT technical team had in-depth exchanges with visiting exhibitors, conducted on-site demonstrations and discussions on specific issues related to the enterprise, and multiple enterprises expressed their intention to conduct sample testing and technical cooperation in the future
Fully automatic climbing rubber height measurement system
In semiconductor and LED packaging production lines, the climbing height of the adhesive along the chip sidewall after chip mounting is a key indicator for determining the quality of the dispensing process. Excessive adhesive climbing may contaminate the bonding pads, while insufficient climbing may result in insufficient bonding strength. This micrometer level size control directly affects the reliability of the chip.
Traditional climbing glue measurement relies on manual focusing and reading under a microscope, which is inefficient and difficult to achieve consistent results among different personnel. The MM-45XM-XYZ-3D-C exhibited by LABTT is an automation solution aimed at addressing the pain points of this production line. According to on-site technicians, after one clamping of the system sample, the four sides of the chip are fully automatically measured, and the adhesive height data of any chip, four edges, and multiple measurement lines on each side of a PCB can be obtained with one click.
Electric zoom measuring microscope
The MM-45XM electric zoom measuring microscope, which is exhibited on the same stage as the climbing adhesive specialized system, is positioned as a universal microscopic measuring equipment for precision manufacturing and electronic semiconductor industries.
The core feature of this device is the electrically variable magnification optical system, with a magnification range of 0.7X to 4.5X, supporting two control modes: when disconnected from the computer, the control box can be used to select a fixed magnification for quick sampling, and when connected to the computer, continuous magnification can be achieved, flexibly adapting to the measurement needs of different workpieces. The guarantee of variable magnification accuracy also provides the basic conditions for measurement accuracy.
The two new micro inspection products exhibited this time are the latest achievements of Naibo in the field of semiconductor packaging inspection, and also echo the theme of "Cross border Integration and Full Chain Collaboration" at this year's IC Innovation Expo.
With the continuous improvement of quality control requirements for packaging processes in the integrated circuit industry, automated and digital precision testing solutions are becoming a necessity for production line upgrades. The equipment exhibited by LABTT provides packaging companies with a feasible path from "manual visual inspection" to "one click counting".
